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The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.
The Power Module Packaging Market report offers details about market size, market share, revenue growth, and CAGR during the forecast period. The report also offers key insights about top companies in the market along with a thorough SWOT analysis, Porter’s Five Forces analysis, and feasibility analysis to offer competitive edge to the readers. The report focuses on the recent trends, major challenges and opportunities, and limitations pertaining to the ongoing pandemic.
Claim Your FREE Sample Copy with Table of content@ https://www.emergenresearch.com/request-sample/2356
The leading market contenders listed in the report are:
SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
The research study examines historic data from 2018 and 2020 to draw forecasts until 2030. The timeline makes the report an invaluable resource for readers, investors, and stakeholders looking for key insights in readily accessible documents with the information presented in the form of tables, charts, and graphs.
To Visit Full Report & Table of Contents Power Module Packaging Market: https://www.emergenresearch.com/industry-report/power-module-packaging-market
Market Overview:
The report bifurcates the Power Module Packaging market on the basis of different product types, applications, end-user industries, and key regions of the world where the market has already established its presence. The report accurately offers insights into the supply-demand ratio and production and consumption volume of each segment.
Segments Covered in this report are:
The research report offers a comprehensive regional analysis of the market with regards to production and consumption patterns, import/export, market size and share in terms of volume and value, supply and demand dynamics, and presence of prominent players in each market.
Get An Impressive Discount On This Report@ https://www.emergenresearch.com/request-discount/2356
Regional Analysis Covers:
North America (U.S., Canada)
Europe (U.K., Italy, Germany, France, Rest of EU)
Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
Latin America (Chile, Brazil, Argentina, Rest of Latin America)
Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
Key reasons to buy the Global Power Module Packaging Market report:
The Power Module Packaging Market report offers details about market size, market share, revenue growth, and CAGR during the forecast period. The report also offers key insights about top companies in the market along with a thorough SWOT analysis, Porter’s Five Forces analysis, and feasibility analysis to offer competitive edge to the readers. The report focuses on the recent trends, major challenges and opportunities, and limitations pertaining to the ongoing pandemic.
Claim Your FREE Sample Copy with Table of content@ https://www.emergenresearch.com/request-sample/2356
The leading market contenders listed in the report are:
SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
The research study examines historic data from 2018 and 2020 to draw forecasts until 2030. The timeline makes the report an invaluable resource for readers, investors, and stakeholders looking for key insights in readily accessible documents with the information presented in the form of tables, charts, and graphs.
To Visit Full Report & Table of Contents Power Module Packaging Market: https://www.emergenresearch.com/industry-report/power-module-packaging-market
Market Overview:
The report bifurcates the Power Module Packaging market on the basis of different product types, applications, end-user industries, and key regions of the world where the market has already established its presence. The report accurately offers insights into the supply-demand ratio and production and consumption volume of each segment.
Segments Covered in this report are:
Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
- Silicon Carbide (SiC) Module
- Gallium Nitride (GaN) Module
- Insulated-Gate Bipolar Transistor (IGBT) Module
- Field-Effect Transistor (FET) Module
- Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
- Others
Technology Outlook (Revenue, USD Billion; 2019-2032)
- Standard Packaging
- Advanced Packaging
- Pressure-Contact Modules
- Others
Thermal type Outlook (Revenue, USD Billion; 2019-2032)
- Liquid-Cooled
- Air-Cooled
- Hybrid
The research report offers a comprehensive regional analysis of the market with regards to production and consumption patterns, import/export, market size and share in terms of volume and value, supply and demand dynamics, and presence of prominent players in each market.
Get An Impressive Discount On This Report@ https://www.emergenresearch.com/request-discount/2356
Regional Analysis Covers:
North America (U.S., Canada)
Europe (U.K., Italy, Germany, France, Rest of EU)
Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
Latin America (Chile, Brazil, Argentina, Rest of Latin America)
Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
Key reasons to buy the Global Power Module Packaging Market report:
- The latest report comprehensively studies the global Power Module Packaging market size and provides useful inference on numerous aspects of the market, such as the current business trends, market share, product offerings, and product share.
- The report offers an insightful analysis of the regional outlook of the market.
- It offers a detailed account of the end-use applications of the products & services offered by this industry.
- The report holistically covers the latest developments taking place in this industry. Therefore, it lists the most effective business strategies implemented by the market rivals for ideal business expansion.
